ESP32 Boards/ ESP32-S3/ ESP32-S3-WROOM-1

ESP32-S3-WROOM-1

ACTIVE WROOM

Dual-core Wi-Fi + Bluetooth LE MCU with neural network and signal processing acceleration, ideal for AIoT applications such as wake word detection, face recognition, and smart devices.

ESP32-S3-WROOM-1 module
18 × 25.5 mm
16MB
Flash
16MB
PSRAM
41
GPIO pins
18×25.5mm
Size

Specifications

Datasheet ↗

Module

FamilyWROOM
Embedded chipESP32-S3, ESP32-S3R2, ESP32-S3R8
GPIO pins41
AntennaPCB antenna
Dev boardESP32-DevKitC, ESP32-S3-DevKitC-1, ESP32-S3-BOX-3, ESP32-S3-BOX, ESP32-S3-EYE, ESP32-S3-Korvo-1, ESP32-S3-Korvo-2, ESP32-S3-LCD-EV-Board
Operating temp-40°C ~ 85°C
Dimensions18 × 25.5 × 3.1 mm

Memory

Flash4 / 8 / 16 MB
PSRAMUp to 16 MB

Connectivity

Wi-Fi802.11 b/g/n (2.4 GHz)
Bluetooth5.0
BLE5.0

Module variants

11 variants
Base lowest-cost config Top highest spec High-temp extended temperature range
VariantFlashPSRAMTags
ESP32-S3-WROOM-1-N44 MB-Base
ESP32-S3-WROOM-1-N88 MB-
ESP32-S3-WROOM-1-N1616 MB-
ESP32-S3-WROOM-1-H44 MB-High-temp
ESP32-S3-WROOM-1-N4R24 MB2 MB
ESP32-S3-WROOM-1-N8R28 MB2 MB
ESP32-S3-WROOM-1-N16R216 MB2 MB
ESP32-S3-WROOM-1-N4R84 MB8 MB
ESP32-S3-WROOM-1-N8R88 MB8 MB
ESP32-S3-WROOM-1-N16R816 MB8 MB
ESP32-S3-WROOM-1-N16R16VA16 MB16 MBTop

About the ESP32-S3-WROOM-1

ESP32-S3-WROOM-1 is a dual-core Wi-Fi + Bluetooth LE MCU module with neural network and signal processing acceleration, ideal for AIoT and smart device applications.

  • Size: 18 x 25.5 x 3.1 mm
  • Wi-Fi (2.4 GHz), Bluetooth LE
  • Neural network and signal processing acceleration
  • Multiple flash and PSRAM options
  • Wide operating temperature range: -40°C ~ 85°C
  • Integrated PCB antenna
  • Perfect for AIoT, smart home, and industrial devices

The ESP32-S3-WROOM-1 module comes in various configurations to suit different application needs:

  • N4: 4MB flash, no PSRAM - Basic variant for general applications.
  • N8: 8MB flash, no PSRAM - Enhanced variant for applications requiring more flash storage.
  • N16: 16MB flash, no PSRAM - Large flash size variant for data-intensive applications.
  • H4: 4MB flash, no PSRAM - High temperature variant for extreme environments.
  • N4R2: 4MB flash, 2MB PSRAM - Basic variant with added PSRAM for memory-intensive tasks.
  • N8R2: 8MB flash, 2MB PSRAM - Enhanced variant with added PSRAM for better performance.
  • N16R2: 16MB flash, 2MB PSRAM - Large flash size with PSRAM for high-performance applications.
  • N4R8: 4MB flash, 8MB PSRAM - Basic variant with significant memory for demanding tasks.
  • N8R8: 8MB flash, 8MB PSRAM - Enhanced variant with substantial memory for complex applications.
  • N16R8: 16MB flash, 8MB PSRAM - Large flash size with ample memory for advanced applications.
  • N16R16VA: 16MB flash, 16MB PSRAM - Top variant with maximum flash and memory for the most demanding applications.

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